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According to South Korean media The Elec, Apple has recently requested Samsung to start researching a new packaging method for Low Power Double Data Rate (LPDDR) DRAM in order to further enhance the edge AI performance of the iPhone. This requirement marks Apple's continued efforts to enhance the AI capabilities of its devices. Currently, Apple's iPhone uses a Package on Package (PoP) solution, stacking LPDDR DRAM directly on top of the System on Chip (SoC), a design that has been in use since 2010.

Samsung Electronics has started mass production of the industry's thinnest low-power Dynamic Random Access Memory (DRAM) chips to meet the growing demand for artificial intelligence (AI) in mobile devices. The newly launched 12-nanometer, 12GB, and 16GB LPDDR5X DRAM chips are only as thick as a fingernail, achieved through Samsung's expertise in chip packaging technology. This design not only provides more space for mobile devices but also improves airflow and optimizes thermal management. In terms of performance, Samsung's LPDDR5X DRAM chips deliver.

Samsung Electronics reported a 77.9% year-on-year decline in operating profit in the third quarter, with losses in its chip business. The company aims to launch the sixth generation of high-performance HBM4 memory chips in 2025 to compete for dominance in the AI chip market. The demand for HBM memory continues to grow to support AI systems, data centers, and machine learning platforms. Samsung has been competing with SK Hynix for dominance in the HBM memory market. In 2016, Samsung commercialized HBM memory, becoming the first to enter the AI memory chip market.